Fibocom Unveils SC153 5G Smart Module at NetworkX 2026
The new SC153 module aims to enhance smart device connectivity.
Fibocom has introduced its SC153 5G smart module at the NetworkX 2026 event, marking its first public demonstration. This module is built on Qualcomm's Dragonwing Q-4390 processor, designed to meet the increasing demands for high-speed, stable, and low-latency wireless connectivity in next-generation smart devices.
The SC153 supports advanced 5G communications, complying with 3GPP Release 16, and offers multimode connectivity across sub-6 GHz 5G NR and LTE networks. This capability is essential for applications requiring rapid data transmission, such as high-definition video streaming and industrial data acquisition.
In terms of performance, the SC153 can achieve maximum downlink speeds of up to 2.3 Gbps in standalone mode and 2.5 Gbps in non-standalone mode. This positions the module as a critical component for developers seeking to enable efficient data transmission in smart devices and industrial applications.
The module's design is flexible, featuring an LGA package with multiple interfaces, including MIPI display, MIPI camera, USB 3.1, UART, I²C, and SD. It also supports various Wi-Fi configurations, accommodating the diverse design needs of modern smart devices.
Fibocom is currently debugging the SC153, with plans for mass production set for the fourth quarter of 2026. The company's collaboration with Qualcomm aims to enhance the capabilities of smart devices, addressing the evolving landscape of connectivity requirements.
As the demand for intelligent and connected devices grows, the introduction of the SC153 represents a significant step forward in enabling manufacturers to develop advanced wireless solutions. The announcement was made through PR Newswire.
This is an independent summary of a press release originally distributed via PR Newswire. GAX Online was not paid for this coverage.
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